先进半导体封装 Master of Science in Advanced Semiconductor Packaging

The Master of Science Programme in Advanced Semiconductor Packaging involves five schools and centres: the School of Materials and Mineral Resources Engineering, School of Electric and Electronic Engineering, School of Mechanical Engineering, Institute of Nano Optoelectronics Research and Technology (INOR) and the Collaborative Microelectronic Design Excellence Centre (CEDEC). This programme started based on collaboration activities with various semiconductor companies that produced high-end printed circuit board and integrated circuit substrates. The research component requires candidates to select a research topic and carry out an intensive research study under the supervision of a lecturer. Teaching and learning is conducted in a hybrid (blended learning) mode, both physical and online.